Patents/Inventors

Omkar G. Karhade

Chandler, AZUS33 patents

28 Patents

US125990342026
Microelectronic Structure Including Active Base Substrate with Through Vias Between a Top Die and a Bottom Die Supported on an Interposer
Intel Corporation
0 cites
US125910922026
Covered Cavity for a Photonic Integrated Circuit (PIC)
Intel Corporation
0 cites
US125819882026
Microelectronic Assemblies with Through Die Attach Film Connections
Intel Corporation
0 cites
US125507812026
Template Structure for Quasi-monolithic Die Architectures
Intel Corporation
0 cites
US125388412026
Quasi-monolithic Die Architectures
Intel Corporation
0 cites
US125045802025
Reduced Bridge Structure for a Photonic Integrated Circuit
Intel Corporation
0 cites
US125061272025
Package Architecture of Photonic System with Vertically Stacked Dies Having Planarized Edges
Intel Corporation
0 cites
US125061282025
Package Architecture of Scalable Compute Wall Having Compute Bricks with Vertically Stacked Dies
Intel Corporation
0 cites
US124380932025
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US124226152025
Nested Glass Packaging Architecture for Hybrid Electrical and Optical Communication Devices
Intel Corporation
0 cites
US124128422025
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US124128682025
Microelectronic Assemblies Including Interconnects with Different Solder Materials
Intel Corporation
0 cites
US123993342025
Photonic Integrated Circuit Packaging Architectures
Intel Corporation
0 cites
US123929702025
Photonic Integrated Circuit Packaging Architectures
Intel Corporation
0 cites
US123477802025
Integrated Circuit Package with Flipped High Bandwidth Memory Device
Intel Corporation
0 cites
US122726502025
Microelectronic Package with Substrate Cavity for Bridge-attach
Intel Corporation
0 cites
US122437922025
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US121817102024
Photonic Integrated Circuit Packaging Architecture
Intel Corporation
0 cites
US121835962024
Low Cost Package Warpage Solution
Intel Corporation
0 cites
US121193262024
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US121130232024
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US119233072024
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US118879622024
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US118549452023
Underfill Material Flow Control for Reduced Die-to-die Spacing in Semiconductor Packages
Tahoe Research, Ltd.
0 cites
US118044412023
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US117912742023
Multichip Semiconductor Package Including a Bridge Die Disposed in a Cavity Having Non-planar Interconnects
Intel Corporation
0 cites
US117640802023
Low Cost Package Warpage Solution
Intel Corporation
0 cites
US117355582023
Microelectronic Structures Including Bridges
Intel Corporation
0 cites