Omar Elleuch

2 Patents

• US125753812026

  Method of Forming Silicon Within a Gap on a Surface of a Substrate

  ASM IP Holding B.V.

  0 cites
• US123621742025

  Method and Wafer Processing Furnace for Forming an Epitaxial Stack on a Plurality of Substrates

  ASM IP Holding B.V.

  0 cites