3 Patents
- US123851282025Cooling Device and Process for Cooling Double-sided Sip Devices During Sputtering
STATS Chippac Pte. Ltd.
0 cites - US119329332024Cooling Device and Process for Cooling Double-sided Sip Devices During Sputtering
STATS Chippac Pte. Ltd.
0 cites - US118429912023Semiconductor Device and Method of Forming a 3D Interposer System-in-package Module
STATS Chippac Pte. Ltd.
0 cites