8 Patents
- US125388032026Semiconductor Package Including a Barrier Structure Covering Connection Pads and Contacting a Protruding Portion of an Adhesive Layer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US118879132024Integrated Circuit Device and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- 0 cites
- 0 cites
- US115454172023Integrated Circuit Device and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites - US115455122023Image Sensor Package with Underfill and Image Sensor Module Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites