Patents/Inventors

Norihiko Sakamoto

TokyoJP2 patents

3 Patents

US126066622026
Photosensitive Resin Composition, Photosensitive Resin Film, Multilayered Printed Wiring Board, Semiconductor Package, and Method for Producing Multilayered Printed Wiring Board
RESONAC CORPORATION
0 cites
US117952932023
Epoxy Resin, Epoxy Resin Composition, Resin Sheet, B-stage Sheet, C-stage Sheet, Cured Product, Metal Foil with Resin, Metal Substrate, and Power Semiconductor Device
RESONAC CORPORATION
0 cites
US115812122023
Prepreg for Coreless Substrate, Coreless Substrate and Semiconductor Package
Showa Denko Materials Co., Ltd.
0 cites