16 Patents
- US126222682026Copper/ceramic Bonded Body and Insulating Circuit Substrate
MITSUBISHI MATERIALS CORPORATION
0 cites - US126222692026Copper/ceramic Bonded Body and Insulating Circuit Substrate
MITSUBISHI MATERIALS CORPORATION
0 cites - US125507312026Copper/ceramic Assembly, Insulating Circuit Substrate, Production Method for Copper/ceramic Assembly, and Production Method for Insulating Circuit Substrate
MITSUBISHI MATERIALS CORPORATION
0 cites - US124514042025Copper-ceramic Bonded Body, Insulated Circuit Board, Method for Producing Copper-ceramic Bonded Body, and Method for Producing Insulated Circuit Board
MITSUBISHI MATERIALS CORPORATION
0 cites - US121990062025Bonded Body, Power Module Substrate, Power Module, Method for Manufacturing Bonded Body, and Method for Manufacturing Power Module Substrate
MITSUBISHI MATERIALS CORPORATION
0 cites - US121686342024Copper/ceramic Bonded Body, Insulating Circuit Substrate, Copper/ceramic Bonded Body Production Method, and Insulating Circuit Substrate Production Method
MITSUBISHI MATERIALS CORPORATION
0 cites - US121257652024Copper/ceramic Joined Body and Insulating Circuit Substrate
MITSUBISHI MATERIALS CORPORATION
0 cites - 0 cites
- US120372942024Copper/ceramic Bonded Body, Insulating Circuit Substrate, Copper/ceramic Bonded Body Production Method, and Insulating Circuit Substrate Production Method
MITSUBISHI MATERIALS CORPORATION
0 cites - US120354682024Bonded Body, Insulated Circuit Board with Heat Sink, and Heat Sink
MITSUBISHI MATERIALS CORPORATION
0 cites - US120274342024Bonded Body of Copper and Ceramic, Insulating Circuit Substrate, Bonded Body of Copper and Ceramic Production Method, and Insulating Circuit Substrate Production Method
MITSUBISHI MATERIALS CORPORATION
0 cites - US120027322024Copper/ceramic Assembly, Insulated Circuit Board, Method for Producing Copper/ceramic Assembly, and Method for Producing Insulated Circuit Board
MITSUBISHI MATERIALS CORPORATION
0 cites - US118879092024Copper/titanium/aluminum Joint, Insulating Circuit Substrate, Insulating Circuit Substrate with Heat Sink, Power Module, LED Module, and Thermoelectric Module
MITSUBISHI MATERIALS CORPORATION
0 cites - US118814392024Copper/ceramic Joined Body, Insulating Circuit Substrate, Copper/ceramic Joined Body Production Method, and Insulating Circuit Substrate Production Method
MITSUBISHI MATERIALS CORPORATION
0 cites - US117988562023Ceramic/aluminum Bonded Body, Insulating Substrate, LED Module, Ceramic Member, Method for Producing Ceramic/aluminum Bonded Body, and Method for Producing Insulating Substrate
MITSUBISHI MATERIALS CORPORATION
0 cites - US116383502023Copper/ceramic Bonded Body, Insulating Circuit Board, Method for Producing Copper/ceramic Bonded Body, and Method for Producing Insulating Circuit Board
MITSUBISHI MATERIALS CORPORATION
0 cites