3 Patents
- US126160432026Package Comprising Integrated Devices with Inner and Outer Solder Interconnects
QUALCOMM INCORPORATED
0 cites - US120876812024Packaged Integrated Device with Memory Buffer Integrated Circuit Die and Memory Devices on Module Substrate
Rambus Inc.
0 cites - US117422772023Packaged Integrated Device Having Memory Buffer Integrated Circuit Asymmetrically Positioned on Substrate
Rambus Inc.
0 cites