Patents/Inventors

Nitin Deshpande

Chandler, AZUS18 patents

16 Patents

US125990072026
Composite IC Die Package Including an Electro-thermo-mechanical Die (ETMD) with Through Substrate Vias
Intel Corporation
0 cites
US125640902026
Edge-aligned Template Structure for Integrated Packages Including an Integrated Circuit Device Within an Opening of the Template Structure
Intel Corporation
0 cites
US125001322025
Formation of a Reconstituted Circuit Device Using Flow of a Material by Capillary Action
Intel Corporation
0 cites
US124811082025
Faraday Rotator Interconnect as a Through-via Configuration in a Patch Architecture
Intel Corporation
0 cites
US124698012025
Moisture Seal Coating of Hybrid Bonded Stacked Die Package Assembly
Intel Corporation
0 cites
US124068932025
Edge-aligned Template Structure for Integrated Circuit Packages
Intel Corporation
0 cites
US123861272025
Micro-lens Array Optically Coupled with a Photonics Die
Intel Corporation
0 cites
US123530322025
Enabling Passive Alignment for Lens Attach
Intel Corporation
0 cites
US121744362024
Package Expanded Beam Connector for On-package Optics
Intel Corporation
0 cites
US121762682024
Open Cavity Bridge Co-planar Placement Architectures and Processes
Intel Corporation
0 cites
US120613712024
Patch on Interposer Architecture for Low Cost Optical Co-packaging
Intel Corporation
0 cites
US120448882024
Silicon Groove Architectures and Manufacturing Processes for Passive Alignment in a Photonics Die
Intel Corporation
0 cites
US120274482024
Open Cavity Bridge Power Delivery Architectures and Processes
Intel Corporation
0 cites
US116769002023
Electronic Assembly That Includes a Bridge
Intel Corporation
0 cites
US115748512023
Coupled Cooling Fins in Ultra-small Systems
Intel Corporation
0 cites
US115454072023
Thermal Management Solutions for Integrated Circuit Packages
Intel Corporation
0 cites