Patents/Inventors

Nitin A. Deshpande

Chandler, AZUS24 patents

23 Patents

US125990342026
Microelectronic Structure Including Active Base Substrate with Through Vias Between a Top Die and a Bottom Die Supported on an Interposer
Intel Corporation
0 cites
US125910922026
Covered Cavity for a Photonic Integrated Circuit (PIC)
Intel Corporation
0 cites
US125060852025
HBI Die Architecture with Fiducial in Street for No Metal Depopulation in Active Die
Intel Corporation
0 cites
US125061272025
Package Architecture of Photonic System with Vertically Stacked Dies Having Planarized Edges
Intel Corporation
0 cites
US125061282025
Package Architecture of Scalable Compute Wall Having Compute Bricks with Vertically Stacked Dies
Intel Corporation
0 cites
US124380932025
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US124226152025
Nested Glass Packaging Architecture for Hybrid Electrical and Optical Communication Devices
Intel Corporation
0 cites
US124128422025
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US123993342025
Photonic Integrated Circuit Packaging Architectures
Intel Corporation
0 cites
US123929702025
Photonic Integrated Circuit Packaging Architectures
Intel Corporation
0 cites
US122726502025
Microelectronic Package with Substrate Cavity for Bridge-attach
Intel Corporation
0 cites
US122437922025
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US121817102024
Photonic Integrated Circuit Packaging Architecture
Intel Corporation
0 cites
US121835962024
Low Cost Package Warpage Solution
Intel Corporation
0 cites
US121487422024
Active Bridge Enabled Co-packaged Photonic Transceiver
Intel Corporation
0 cites
US121130232024
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US119233072024
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US118879622024
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US118549452023
Underfill Material Flow Control for Reduced Die-to-die Spacing in Semiconductor Packages
Tahoe Research, Ltd.
0 cites
US118044412023
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US117912742023
Multichip Semiconductor Package Including a Bridge Die Disposed in a Cavity Having Non-planar Interconnects
Intel Corporation
0 cites
US117640802023
Low Cost Package Warpage Solution
Intel Corporation
0 cites
US117355582023
Microelectronic Structures Including Bridges
Intel Corporation
0 cites