Nita Chandrasekhar

2 Patents

• US126108062026

  Interconnect Structures with Nitrogen-rich Dielectric Material Interfaces for Low Resistance Vias in Integrated Circuits

  Intel Corporation

  0 cites
• US120876142024

  Gap Fill Dielectrics for Electrical Isolation of Transistor Structures in the Manufacture of Integrated Circuits

  Intel Corporation

  0 cites