Patents/Inventors

Nisha Ananthakrishnan

Chandler, AZUS4 patents

5 Patents

US124179582025
Microelectronics Package Comprising a Package-on-package (pop) Architecture with Inkjet Barrier Material for Controlling Bondline Thickness and Pop Adhesive Keep Out Zone
Intel Corporation
0 cites
US123477432025
Microelectronics Package Comprising a Package-on-package (pop) Architecture with Inkjet Barrier Material for Controlling Bondline Thickness and Pop Adhesive Keep Out Zone
Intel Corporation
0 cites
US123157772025
Microelectronics Package Comprising a Package-on-package (POP) Architecture with Inkjet Barrier Material for Controlling Bondline Thickness and POP Adhesive Keep Out Zone
Intel Corporation
0 cites
US118044702023
Wafer Level Passive Heat Spreader Interposer to Enable Improved Thermal Solution for Stacked Dies in Multi-chips Package and Warpage Control
Intel Corporation
0 cites
US117768212023
Micro-electronic Package with Substrate Protrusion to Facilitate Dispense of Underfill Between a Narrow Die-to-die Gap
Intel Corporation
0 cites