Patents/Inventors

Nicolas Schorr

ReutlingenDE1 patent

2 Patents

US124041702025
Method for Producing a Bonding Pad for a Micromechanical Sensor Element
ROBERT BOSCH GmbH
0 cites
US120947172024
Method for Forming a Trench in a First Semiconductor Layer of a Multi-layer System
ROBERT BOSCH GmbH
0 cites