Patents/Inventors

Nico Lange

ErfurtDE3 patents

3 Patents

US123492872025
Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder Into a Through Hole
Pac Tech—packaging Technologies GmbH
0 cites
US120289872024
Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder Into a Through Hole
Pac Tech—packaging Technologies GmbH
0 cites
US115613582023
Method for the Continuous Production of Optical Fibre Waveguide Sensors Mounted in a Perforated Metal Hollow Profile
NEXANS
0 cites