5 Patents
- US121273382024Semi-flex Component Carrier with Dielectric Material Surrounding an Embedded Component and Having Locally Reduced Young Modulus
At&s(china) Co. Ltd.
0 cites - US120588102024Semi-flex Component Carrier with Dielectric Material Having High Elongation and Low Young Modulus
At&saustria Technologie &Systemtechnik AG
0 cites - US116706132023Arrangement with Central Carrier and Two Opposing Layer Stacks, Component Carrier and Manufacturing Method
AT&S (China) Co. Ltd.
0 cites - 0 cites
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