Patents/Inventors

Nick Ross

Chandler, AZUS4 patents

5 Patents

US124179582025
Microelectronics Package Comprising a Package-on-package (pop) Architecture with Inkjet Barrier Material for Controlling Bondline Thickness and Pop Adhesive Keep Out Zone
Intel Corporation
0 cites
US123477432025
Microelectronics Package Comprising a Package-on-package (pop) Architecture with Inkjet Barrier Material for Controlling Bondline Thickness and Pop Adhesive Keep Out Zone
Intel Corporation
0 cites
US123157772025
Microelectronics Package Comprising a Package-on-package (POP) Architecture with Inkjet Barrier Material for Controlling Bondline Thickness and POP Adhesive Keep Out Zone
Intel Corporation
0 cites
USD10125302024
Chair
0 cites
USD09908962023
Chair
0 cites