10 Patents
- US125435782026Electronic Packaging Architecture with Customized Variable Metal Thickness on Same Buildup Layer
Intel Corporation
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- US123344532025Soldered Metallic Reservoirs for Enhanced Transient and Steady-state Thermal Performance
Intel Corporation
0 cites - US122611502025Mold Shelf Package Design and Process Flow for Advanced Package Architectures
Intel Corporation
0 cites - US120877312024No Mold Shelf Package Design and Process Flow for Advanced Package Architectures
Intel Corporation
0 cites - 0 cites
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- US119013332024No Mold Shelf Package Design and Process Flow for Advanced Package Architectures
Intel Corporation
0 cites - 0 cites
- US117768642023Corner Guard for Improved Electroplated First Level Interconnect Bump Height Range
Intel Corporation
0 cites