3 Patents
- US121070822024Offset Interposers for Large-bottom Packages and Large-die Package-on-package Structures
Intel Corporation
0 cites - US119787302024Offset Interposers for Large-bottom Packages and Large-die Package-on-package Structures
Intel Corporation
0 cites - US117989322023Offset Interposers for Large-bottom Packages and Large-die Package-on-package Structures
Intel Corporation
0 cites