Patents/Inventors

Nicholas Neal

Scottsdale, AZUS16 patents

17 Patents

US123622502025
Protruding SN Substrate Features for Epoxy Flow Control
Intel Corporation
0 cites
US123344532025
Soldered Metallic Reservoirs for Enhanced Transient and Steady-state Thermal Performance
Intel Corporation
0 cites
US122665892025
Enhanced Base Die Heat Path Using Through-silicon Vias
Intel Corporation
0 cites
US122611502025
Mold Shelf Package Design and Process Flow for Advanced Package Architectures
Intel Corporation
0 cites
US120877312024
No Mold Shelf Package Design and Process Flow for Advanced Package Architectures
Intel Corporation
0 cites
US120573692024
Enhanced Base Die Heat Path Using Through-silicon Vias
Intel Corporation
0 cites
US120092712024
Protruding SN Substrate Features for Epoxy Flow Control
Intel Corporation
0 cites
US119423932024
Substrate with Thermal Insulation
Intel Corporation
0 cites
US119012622024
Cooling Solution Including Microchannel Arrays and Methods of Forming the Same
Intel Corporation
0 cites
US119013332024
No Mold Shelf Package Design and Process Flow for Advanced Package Architectures
Intel Corporation
0 cites
US118549352023
Enhanced Base Die Heat Path Using Through-silicon Vias
Intel Corporation
0 cites
US118324192023
Full Package Vapor Chamber with IHS
Intel Corporation
0 cites
US118044182023
Direct Liquid Micro Jet (DLMJ) Structures for Addressing Thermal Performance at Limited Flow Rate Conditions
Intel Corporation
0 cites
US117768642023
Corner Guard for Improved Electroplated First Level Interconnect Bump Height Range
Intel Corporation
0 cites
US116409292023
Thermal Management Solutions for Cored Substrates
Intel Corporation
0 cites
US115944632023
Substrate Thermal Layer for Heat Spreader Connection
Intel Corporation
0 cites
US115878432023
Thermal Bump Networks for Integrated Circuit Device Assemblies
Intel Corporation
0 cites