Ni Shen

3 Patents

• US126132702026

  Wafer Acceptance Test Tool and Test Method Using Thereof

  TSMC CHINA COMPANY LIMITED

  0 cites
• US119945552024

  Probe Card with Angled Probe and Wafer Testing Method Using the Same

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US116872112023

  System and Method for Dossier Creation with Linking Dossiers and Context Passing

  MICROSTRATEGY INCORPORATED

  0 cites