Patents/Inventors

Neng-chieh Chang

TainanTW1 patent

2 Patents

US122551662025
Semiconductor Package Structure Comprising via Structure and Redistribution Layer Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118174132023
Semiconductor Package Structure Comprising via Structure and Redistribution Layer Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites