Patents/Inventors

Nazila Dadvand

Santa Clara, CAUS16 patents

17 Patents

US124761732025
Electronic Device with Post Mold Plated Nickel Tungsten and Tin Bilayer for Improved Board Level Reliability
TEXAS INSTRUMENTS INCORPORATED
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US123127032025
Neutral Ph Copper Plating Solution for Undercut Reduction
TEXAS INSTRUMENTS INCORPORATED
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US122372192025
Contact with Bronze Material to Mitigate Undercut
TEXAS INSTRUMENTS INCORPORATED
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US121805952024
Chemically Anchored Mold Compounds in Semiconductor Packages
TEXAS INSTRUMENTS INCORPORATED
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US121548452024
Semiconductor Package with Nickel-silver Pre-plated Leadframe
TEXAS INSTRUMENTS INCORPORATED
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US121395692024
Filler Particles for Polymers
TEXAS INSTRUMENTS INCORPORATED
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US120740962024
Die Attach Surface Copper Layer with Protective Layer for Microelectronic Devices
TEXAS INSTRUMENTS INCORPORATED
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US120682212024
Plating for Thermal Management
TEXAS INSTRUMENTS INCORPORATED
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US119844182024
Method of Forming Brass-coated Metals in Flip-chip Redistribution Layers
TEXAS INSTRUMENTS INCORPORATED
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US119387152024
SP 2 -bonded Carbon Structures
TEXAS INSTRUMENTS INCORPORATED
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US119358212024
Quad Flat No-lead Package with Wettable Flanges
TEXAS INSTRUMENTS INCORPORATED
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US119087762024
Semiconductor Device with Metal Die Attach to Substrate with Multi-size Cavity
TEXAS INSTRUMENTS INCORPORATED
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US118549332023
Thermally Conductive Wafer Layer
TEXAS INSTRUMENTS INCORPORATED
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US118482582023
Semiconductor Package with Nickel-silver Pre-plated Leadframe
Texas Instruments Incorporated
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US116949472023
Multi-pitch Leads
Texas Instruments Incorporated
0 cites
US115945042023
Nickel Alloy for Semiconductor Packaging
TEXAS INSTRUMENTS INCORPORATED
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US115878582023
Zinc-cobalt Barrier for Interface in Solder Bond Applications
TEXAS INSTRUMENTS INCORPORATED
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