5 Patents
- 0 cites
- US122306912025Three Dimensional Device Formation Using Early Removal of Sacrificial Heterostructure Layer
Applied Materials, Inc.
0 cites - US119488322024Bottom Implant and Airgap Isolation for Nanosheet Semiconductor Devices
Applied Materials, Inc.
0 cites - US119423612024Semiconductor Device Cavity Formation Using Directional Deposition
Applied Materials, Inc.
0 cites - 0 cites