Nathan Ip

5 Patents

• US126159902026

  Integrated Metrology for Process Controls in Wafer Bonding System

  Tokyo Electron Limited

  0 cites
• US124790702025

  Wafer Chuck with Tunable Stiffness Material

  Tokyo Electron Limited

  0 cites
• US118681192024

  Method and Process Using Fingerprint Based Semiconductor Manufacturing Process Fault Detection

  Tokyo Electron Limited

  0 cites
• US115944312023

  Wafer Bonding Apparatus and Methods to Reduce Post-bond Wafer Distortion

  Tokyo Electron Limited

  0 cites
• US115748082023

  Plasma Processing Method and Plasma Processing Apparatus

  Tokyo Electron Limited

  0 cites