Patents/Inventors

Naofumi Ohashi

ToyamaJP30 patents

26 Patents

US126222122026
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Non-transitory Computer-readable Recording Medium
Kokusai Electric Corporation
0 cites
US125819022026
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording Medium
KOKUSAI ELECTRIC CORPORATION
0 cites
US125818822026
Substrate Processing Method, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Kokusai Electric Corporation
0 cites
US125675712026
Method of Manufacturing Semiconductor Device
Kokusai Electric Corporation
0 cites
US124244092025
Substrate Processing Apparatus, Substrate Processing Method, Method of Manufacturing Semiconductor Device, and Non-transitory Computer-readable Recording Medium
Kokusai Electric Corporation
0 cites
US123920322025
Substrate Processing Apparatus with Cleaning of Exhaust System
KOKUSAI ELECTRIC CORPORATION
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US123879492025
Substrate Processing Apparatus
Kokusai Electric Corporation
0 cites
US123277552025
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording Medium
Kokusai Electric Corporation
0 cites
US123277202025
Method of Processing Substrate, Substrate Processing Apparatus, Recording Medium, and Manufacturing Semiconductor Device
KOKUSAI ELECTRIC CORPORATION
0 cites
US123207782025
Method of Processing Substrate, Substrate Processing Apparatus, Method of Manufacturing Semiconductor Processing Apparatus, and Recording Medium
Kokusai Electric Corporation
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US122241852025
Method of Manufacturing Semiconductor Device
Kokusai Electric Corporation
0 cites
US121658942024
Processing Method, Method of Manufacturing Semiconductor, and Substrate Processing Apparatus
Kokusai Electric Corporation
0 cites
US121319022024
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
KOKUSAI ELECTRIC CORPORATION
0 cites
US121069982024
Substrate Processing Apparatus, Substrate Processing Method, Non-transitory Computer-readable Recording Medium and Method of Manufacturing Semiconductor Device
Kokusai Electric Corporation
0 cites
US120930212024
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Recording Medium
Kokusai Electric Corporation
0 cites
US120917512024
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Recording Medium
KOKUSAI ELECTRIC CORPORATION
0 cites
US119675132024
Substrate Processing Apparatus
KOKUSAI ELECTRIC CORPORATION
0 cites
US119268932024
Substrate Processing Apparatus, Substrate Processing Method and Non-transitory Computer-readable Recording Medium Therefor
Kokusai Electric Corporation
0 cites
US119231732024
Substrate Processing Apparatus, Substrate Processing Method, Method of Manufacturing Semiconductor Device, and Non-transitory Computer-readable Recording Medium
Kokusai Electric Corporation
0 cites
US118916972024
Substrate Processing Apparatus
Kokusai Electric Corporation
0 cites
US118413432023
Method of Processing Substrate, Substrate Processing Apparatus, Method of Manufacturing Semiconductor Processing Apparatus, and Recording Medium
KOKUSAI ELECTRIC CORPORATION
0 cites
US117477892023
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Recording Medium
KOKUSAI ELECTRIC CORPORATION
0 cites
US117495502023
Method of Manufacturing Semiconductor Device by Setting Process Chamber Maintenance Enable State
KOKUSAI ELECTRIC CORPORATION
0 cites
US117281832023
Method of Manufacturing Semiconductor Device
KOKUSAI ELECTRIC CORPORATION
0 cites
US116642052023
Substrate Processing Apparatus
KOKUSAI ELECTRIC CORPORATION
0 cites
US116004882023
Method of Manufacturing Semiconductor Device
KOKUSAI ELECTRIC CORPORATION
0 cites