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Inventors
Nan-chin Chuang
Hsinchu
TW
3 patents
4 Patents
US12046543
2024
Package Substrate and Chip Package Structure Using the Same
REALTEK SEMICONDUCTOR Corp.
0 cites
US12009575
2024
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US11658392
2023
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US11553585
2023
Circuit Board and Electronic Apparatus Using the Same
REALTEK SEMICONDUCTOR Corp.
0 cites