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Inventors
Nan-cheng Chen
Hsin-Chu
TW
5 patents
5 Patents
US12557215
2026
Semiconductor Package Using Flip-chip Technology
MEDIATEK Inc.
0 cites
US11908759
2024
Semiconductor Device
Mediatek Inc.
0 cites
US11848481
2023
Antenna-in-package with Frequency-selective Surface Structure
Mediatek Inc.
0 cites
US11837552
2023
Semiconductor Package with Layer Structures, Antenna Layer and Electronic Component
Mediatek Inc.
0 cites
US11721882
2023
Semiconductor Package Having Discrete Antenna Device
Mediatek Inc.
0 cites