3 Patents
- 0 cites
- US117321232023Thermosetting Resin Composition, and Prepreg, Laminate and Printed Circuit Board Using Same
SHENGYI TECHNOLOGY CO., Ltd.
0 cites - US116493512023Resin Composition for a Metal Substrate, and Resin Varnish and Metal Base Copper-clad Laminate Comprising the Same
Shengyi Technology Co., Ltd.
0 cites