Patents/Inventors

Nai-wei Liu

HsinchuTW9 patents

10 Patents

US121365972024
Semiconductor Package Having an Interposer in Which One or More Dies Are Formed and Method of Forming the Same
MEDIATEK Inc.
0 cites
US119488952024
Semiconductor Package Structure
MEDIATEK Inc.
0 cites
US118547842023
Chip Scale Package Structure and Method of Forming the Same
Mediatek Inc.
0 cites
US118240202023
Semiconductor Package Structure Including Antenna
MEDIATEK Inc.
0 cites
US117912662023
Chip Scale Package Structure and Method of Forming the Same
Mediatek Inc.
0 cites
US117425642023
Fan-out Package Structure with Integrated Antenna
Mediatek Inc.
0 cites
US117282922023
Semiconductor Package Assembly Having a Conductive Electromagnetic Shield Layer
Mediatek Inc.
0 cites
US116886552023
Semiconductor Package Including Lid Structure with Opening and Recess
MEDIATEK Inc.
0 cites
US116522732023
Innovative Air Gap for Antenna Fan Out Package
Mediatek Inc.
0 cites
US115748812023
Semiconductor Package Structure with Antenna
Mediatek Inc.
0 cites