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Nagayasu Hiramatsu
Hillsboro, OR
US
2 patents
3 Patents
US11984319
2024
Substrate Processing Method and Film Forming System
TOKYO ELECTRON LIMITED
0 cites
US11753719
2023
Flow Rate Control Method, Flow Rate Control Device, and Film Forming Apparatus
TOKYO ELECTRON LIMITED
0 cites
US11629404
2023
Method of Forming Tungsten Film and Controller
TOKYO ELECTRON LIMITED
0 cites