Patents/Inventors

Nadine Engelhardt

HeidelbergDE7 patents

6 Patents

US126069252026
Composition for Copper Bump Electrodeposition Comprising a Leveling Agent
BASF SE
0 cites
US125723862026
Automated Task Management in Analytics Computing Systems
SAP SE
0 cites
US125598522026
Composition for Tin-silver Alloy Electroplating Comprising a Complexing Agent
BASF SE
0 cites
US121348342024
Composition for Copper Bump Electrodeposition Comprising a Polyaminoamide Type Leveling Agent
BASF SE
0 cites
US120984732024
Composition for Cobalt Plating Comprising Additive for Void-free Submicron Feature Filling
BASF SE
0 cites
US118407712023
Composition for Tin or Tin Alloy Electroplating Comprising Suppressing Agent
BASF SE
0 cites