Nadia Ben Mohamed

9 Patents

• US125639962026

  Holding Device for an Assembly That Is to Be Fractured

  Soitec

  0 cites
• US124697432025

  Method for Preparing a Thin Layer That Includes Forming a Weakened Zone in a Central Portion of a Donor Substrate That Does Not Extend Into a Peripheral Portion of the Donor Substrate and Initiating and Propagating a Splitting Wave in the Weakened Zone That Does Completely Not Propagate Through the Peripheral Portion

  Commissariat à L'énergie Atomique Et Aux éNergies Alternatives

  0 cites
• US121425172024

  Method for Transferring a Useful Layer from a Donor Substrate Onto a Support Substrate by Applying a Predetermined Stress

  Soitec

  0 cites
• US121007272024

  Method for Manufacturing a Substrate for a Front-facing Image Sensor

  Soitec

  0 cites
• US120026902024

  System for Fracturing a Plurality of Wafer Assemblies

  SOITEC

  0 cites
• US120026972024

  Method for Detecting the Splitting of a Substrate Weakened by Implanting Atomic Species

  Soitec

  0 cites
• US118814292024

  Method for Transferring a Useful Layer Onto a Support Substrate

  SOITEC

  0 cites
• US118760152024

  Method for Transferring a Useful Layer to a Carrier Substrate

  Soitec

  0 cites
• US116705402023

  Substrates Including Useful Layers

  Commissariat à L'énergie Atomique Et Aux éNergies Alternatives

  0 cites