Patents/Inventors

Myungsung Kang

Yongin-siKR2 patents

3 Patents

US124530872025
Semiconductor Device Having Stacked Semiconductor Chips Interconnected with Support Structures via TSV
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123946412025
Molding Apparatus of Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116581412023
Die-to-wafer Bonding Structure and Semiconductor Package Using the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites