Patents/Inventors

Myungsam Kang

Hwaseong-siKR29 patents

30 Patents

US125936842026
Semiconductor Package Including Heat Dissipation Structure
Samsung Electronics Co., Ltd.
0 cites
US123947082025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US123344452025
Method of Fabricating a Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123278262025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US122781912025
Semiconductor Packages Having Wiring Patterns
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122611052025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121836652024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121598262024
Semiconductor Package and Method of Manufacturing the Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121193052024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US120948172024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120626322024
Semiconductor Package Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120573802024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US120465622024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US120402972024
Methods of Manufacturing Semiconductor Packages
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120210202024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US120027982024
Fan-out Type Semiconductor Package and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites
US119358472024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119358492024
Semiconductor Package with an Antenna Substrate
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119160022024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118429502023
Package Module
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118375372023
Fan-out Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118044442023
Semiconductor Package Including Heat Dissipation Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117841292023
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117216202023
Fan-out Type Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116769272023
Semiconductor Package Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116263672023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115812842023
Semiconductor Package with Under-bump Metal Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115691582023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115691752023
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US115629662023
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites