Patents/Inventors

Myungkee Chung

Hwaseong-siKR5 patents

6 Patents

US123410742025
Semiconductor Package with Increased Thermal Dissipation
Samsung Electronics Co., Ltd.
0 cites
US121660132024
Semiconductor Package, and a Package on Package Type Semiconductor Package Having the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121548892024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120093282024
Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117054182023
Semiconductor Package with Conductive Bump on Conductive Post Including an Intermetallic Compound Layer
Samsung Electronics Co., Ltd.
0 cites
US115812342023
Semiconductor Package with Improved Heat Dissipation
Samsung Electronics Co., Ltd.
0 cites