5 Patents
- US126160142026Semiconductor Device Including a Through Electrode Contacting a Backside Conductive Pattern and a Frontside Conductive Pattern and a Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
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- US117282452023Semiconductor Device and Semiconductor Package Including Penetration via Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US116005532023Semiconductor Device Including Through Substrate Vias and Method of Manufacturing the Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
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