6 Patents
- US121487082024Semiconductor Package and Antenna Module Comprising the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- 0 cites
- US116769072023Semiconductor Package and Antenna Module Comprising the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US116054842023Multilayer Seed Pattern Inductor and Manufacturing Method Thereof
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites