30 Patents
- US126146682026Multilayer Electronic Component with Controlled Sn Diffusion in Internal Electrode
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US123744972025Multilayer Electronic Component with Improved Reliability
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US123548032025Multilayer Electronic Component Having Structure for Improved Adhesion Force and Moisture Protection
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US122550222025Multilayer Electronic Component Having Insulating Layer Which Includes Fluorine-based Organic Material
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US120208692024Multilayer Electronic Component Having Improved Electrode Structure for Increased Capacity per Unit Volume
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US119962402024Electronic Component Having a Body and Sealing Thin Film Disposed in a Microhole of the Body
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US118428532023Multilayered Electronic Component and Method of Manufacturing the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US118068072023Laser Welding Method and Laser Welding Device for Secondary Battery
SAMSUNG SDI CO., Ltd.
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- US116054842023Multilayer Seed Pattern Inductor and Manufacturing Method Thereof
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US115877352023Multilayer Electronic Component and Manufacturing Method Thereof
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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