Patents/Inventors

Mutsumi Masumoto

BeppuJP4 patents

5 Patents

US124085512025
Thermoelectric Conversion Module
LINTEC Corporation
0 cites
US121548612024
Frame Design in Embedded Die Package
TEXAS INSTRUMENTS INCORPORATED
0 cites
US121257992024
Embedded Die Packaging with Integrated Ceramic Substrate
TEXAS INSTRUMENTS INCORPORATED
0 cites
US121145682024
Method for Manufacturing Thermoelectric Conversion Module
LINTEC CORPORATION
0 cites
US119233202024
Semiconductor Device Having Tapered Metal Coated Sidewalls
TEXAS INSTRUMENTS INCORPORATED
0 cites