20 Patents
- US125816632026Heterogeneous Integration Structure with Voltage Regulation
International Business Machines Corporation
0 cites - US125688462026Wafer Dies with Thermally Conducting Perimeter Regions
International Business Machines Corporation
0 cites - US125507152026Heterogeneous Integration of Device Die Having BSPDN
International Business Machines Corporation
0 cites - US124697872025Resist Patterned Redistribution Wiring on Copper Polyimide via Layer
International Business Machines Corporation
0 cites - US124514312025Stacked Semiconductor Devices with Topside and Backside Interconnect Wiring
International Business Machines Corporation
0 cites - US124314082025TSV and Backside Power Distribution Structure
International Business Machines Corporation
0 cites - US123006152025Infrared Debond Damage Mitigation by Copper Fill Pattern
International Business Machines Corporation
0 cites - US121990592025Sintering a Nanoparticle Paste for Semiconductor Chip Join
International Business Machines Corporation
0 cites - US121069692024Substrate Thinning for a Backside Power Distribution Network
International Business Machines Corporation
0 cites - US120573712024Semiconductor Device with Early Buried Power Rail (BPR) and Backside Power Distribution Network (BSPDN)
International Business Machines Corporation
0 cites - US120150032024High Density Interconnection and Wiring Layers, Package Structures, and Integration Methods
International Business Machines Corporation
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- US117913262023Memory and Logic Chip Stack with a Translator Chip
International Business Machines Corporation
0 cites - US116826402023Protective Surface Layer on Under Bump Metallurgy for Solder Joining
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - US115454442023Mitigating Cooldown Peeling Stress During Chip Package Assembly
International Business Machines Corporation
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