Patents/Inventors

Motomu Degai

ToyamaJP15 patents

15 Patents

US125818782026
Method of Processing Substrate, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Kokusai Electric Corporation
0 cites
US124008742025
Processing Method, Method of Manufacturing Semiconductor Device, Processing Apparatus, and Recording Medium
KOKUSAI ELECTRIC CORPORATION
0 cites
US123810912025
Method of Processing Substrate, Method of Manufacturing Semiconductor Device, Recording Medium, and Substrate Processing Apparatus
Kokusai Electric Corporation
0 cites
US123745442025
Processing Method, Method of Manufacturing Semiconductor Device, Processing Apparatus, and Recording Medium
Kokusai Electric Corporation
0 cites
US122834762025
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording Medium
Kokusai Electric Corporation
0 cites
US122781032025
Method of Processing Substrate and Method of Manufacturing Semiconductor Device by Forming Film
KOKUSAI ELECTRIC CORPORATION
0 cites
US121762162024
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
KOKUSAI ELECTRIC CORPORATION
0 cites
US120338522024
Method of Processing Substrate, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
KOKUSAI ELECTRIC CORPORATION
0 cites
US119231912024
Method of Manufacturing Semiconductor Device, Method of Processing Substrate, Substrate Processing Apparatus, and Recording Medium
Kokusai Electric Corporation
0 cites
US119231932024
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
KOKUSAI ELECTRIC CORPORATION
0 cites
US118942392024
Method of Processing Substrate, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
KOKUSAI ELECTRIC CORPORATION
0 cites
US118482032023
Methods of Processing Substrate and Manufacturing Semiconductor Device by Forming Film, Substrate Processing Apparatus, and Recording Medium
KOKUSAI ELECTRIC CORPORATION
0 cites
US117053262023
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
KOKUSAI ELECTRIC CORPORATION
0 cites
US116995932023
Method of Manufacturing Semiconductor Device, Substrate Processing Method, Substrate Processing Apparatus, and Recording Medium
KOKUSAI ELECTRIC CORPORATION
0 cites
US115629052023
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
KOKUSAI ELECTRIC CORPORATION
0 cites