12 Patents
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- US125754392026Semiconductor Device Including a Sealing Member to Seal a Semiconductor Chip, a Printed Circuit Board, and a Conductive Block
FUJI ELECTRIC CO., Ltd.
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- US124380562025Semiconductor Device and Method for Determining Deterioration of Semiconductor Device
FUJI ELECTRIC CO., Ltd.
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- US121912452025Semiconductor Device Having a Curved Part in the Printed Circuit Board
FUJI ELECTRIC CO., Ltd.
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- US115454092023Semiconductor Module Having Block Electrode Bonded to Collector Electrode and Manufacturing Method Thereof
FUJI ELECTRIC CO., Ltd.
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