Patents/Inventors

Motohiko Sugiura

OsakaJP1 patent

2 Patents

US122132492025
Method for Manufacturing Dielectric Sheet, Method for Manufacturing Substrate for High-frequency Printed Wiring Board, Dielectric Sheet, and Substrate for High-frequency Printed Wiring Board
SUMITOMO ELECTRIC PRINTED CIRCUITS, Inc.
0 cites
US117527342023
Base Material for Printed Circuit Board and Printed Circuit Board
SUMITOMO ELECTRIC PRINTED CIRCUITS, Inc.
0 cites