Patents/Inventors

Morio Iwamizu

MatsumotoJP3 patents

4 Patents

US120682682024
Semiconductor Device Having a Wire Bonding Pad Structure Connected Through Vias to Lower Wiring
FUJI ELECTRIC CO., Ltd.
0 cites
US120339412024
Trimming Circuit and Trimming Method
FUJI ELECTRIC CO., Ltd.
0 cites
US120215282024
Semiconductor Device
FUJI ELECTRIC CO., Ltd.
0 cites
US115945022023
Semiconductor Device Having Conductive Film
FUJI ELECTRIC CO., Ltd.
0 cites