2 Patents
- US124043612025Amine-based Curing Agents, and Compositions, Semiconductor Packages, and Electronic Devices Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US119266952024High-thermal Conductive Epoxy Compound and Composition, Material for Semiconductor Package, Molded Product, Electric and Electronic Device, and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites