Mohit Bhatia

6 Patents

• US125990342026

  Microelectronic Structure Including Active Base Substrate with Through Vias Between a Top Die and a Bottom Die Supported on an Interposer

  Intel Corporation

  0 cites
• US124128422025

  Microelectronic Structures Including Bridges

  Intel Corporation

  0 cites
• US118879622024

  Microelectronic Structures Including Bridges

  Intel Corporation

  0 cites
• US118044412023

  Microelectronic Structures Including Bridges

  Intel Corporation

  0 cites
• US117912742023

  Multichip Semiconductor Package Including a Bridge Die Disposed in a Cavity Having Non-planar Interconnects

  Intel Corporation

  0 cites
• US117355582023

  Microelectronic Structures Including Bridges

  Intel Corporation

  0 cites