Patents/Inventors

Mohd Kahar Bajuri

MelakaMY2 patents

3 Patents

US122058742025
Semiconductor Package with Wire Bond Joints
Infineon Technologies AG
0 cites
US118429532023
Semiconductor Package with Wire Bond Joints and Related Methods of Manufacturing
Infineon Technologies AG
0 cites
US117053872023
Multi-layer Interconnection Ribbon
Infineon Technologies AG
0 cites