Patents/Inventors

Mohd Afiz Hashim

Shah AlamMY4 patents

3 Patents

US125124352025
Semiconductor Package Having a Solder Wetting Structure
Infineon Technologies AG
0 cites
US122058742025
Semiconductor Package with Wire Bond Joints
Infineon Technologies AG
0 cites
US118429532023
Semiconductor Package with Wire Bond Joints and Related Methods of Manufacturing
Infineon Technologies AG
0 cites