4 Patents
- US126223192026Stacked Die Packaging Architecture with Conductive Vias on Interposer
Intel Corporation
0 cites - US126047592026Microelectronic Assemblies Including Stiffeners Around Individual Dies
Intel Corporation
0 cites - US125640582026Packaging Architecture with Reinforcement Structure in Package Substrate
Intel Corporation
0 cites - US125507362026Packaging Architecture with Reinforcement Structure in Package Substrate
Intel Corporation
0 cites