Mohammad Enamul Kabir

11 Patents

• US125819682026

  Package Architecture of Large Dies Using Quasi-monolithic Chip Layers

  Intel Corporation

  0 cites
• US125388412026

  Quasi-monolithic Die Architectures

  Intel Corporation

  0 cites
• US124698012025

  Moisture Seal Coating of Hybrid Bonded Stacked Die Package Assembly

  Intel Corporation

  0 cites
• US124381022025

  Hermetic Barrier Surrounding a Plurality of Dies

  Intel Corporation

  0 cites
• US123478072025

  Inorganic Fill Material for Stacked Die Assembly

  Intel Corporation

  0 cites
• US122666822025

  Capacitors and Resistors at Direct Bonding Interfaces in Microelectronic Assemblies

  Intel Corporation

  0 cites
• US121990182025

  Direct Bonding in Microelectronic Assemblies

  Intel Corporation

  0 cites
• US121659622024

  Hermetic Sealing Structures in Microelectronic Assemblies Having Direct Bonding

  Intel Corporation

  0 cites
• US121192912024

  Hermetic Sealing Structures in Microelectronic Assemblies Having Direct Bonding

  Intel Corporation

  0 cites
• US121070602024

  Microelectronic Assemblies with Inductors in Direct Bonding Regions

  Intel Corproation

  0 cites
• US120626312024

  Microelectronic Assemblies with Inductors in Direct Bonding Regions

  Intel Corporation

  0 cites