7 Patents
- 0 cites
- 0 cites
- 0 cites
- US120238922024Structure Body, Structure Body Manufacturing Method, and Electronic Apparatus
Tohoku University
0 cites - US119160382024Chemical Bonding Method, Package-type Electronic Component, and Hybrid Bonding Method for Electronic Device
TOHOKU UNIVERSITY
0 cites - US118658292024Functional Element and Method of Manufacturing Functional Element, and Electronic Apparatus
TOHOKU UNIVERSITY
0 cites - 0 cites